Cyanide-free plating

31 Jul.,2025

Cyanide-free gold plating is an environmentally friendly surface treatment technology that replaces traditional cyanide plating solution to achieve gold plating (such as copper-zinc alloy, copper-tin-zinc alloy, etc.) on the surface of steel parts.

 

Author: Marisa

Cyanide-free gold plating is an environmentally friendly surface treatment technology that replaces traditional cyanide plating solution to achieve gold plating (such as copper-zinc alloy, copper-tin-zinc alloy, etc.) on the surface of steel parts.

The following are its key technologies, process steps and precautions:

1. Common systems for cyanide-free imitation gold electroplating

1. Pyrophosphate system
Plated solution composition:

Main salt: copper pyrophosphate + zinc pyrophosphate

Complexing agent: potassium pyrophosphate (K₄P₂O₇)

Additives: brightener (such as sodium thiosulfate), pH buffer

Features:

Environmentally friendly and non-toxic, the plating solution has good stability.

The pH (8.5~9.5) and temperature (40~50℃) need to be strictly controlled.

2. HEDP (hydroxyethylidene diphosphonic acid) system
Plated solution composition:

Main salt: Cu²⁺, Zn²⁺ (or Sn²⁺)

Complexing agent: HEDP (alternative to cyanide)

Auxiliary agent: sodium carbonate, brightener

Features:

The coating is finely crystallized and has strong bonding.

The pH range is wide (9~11) and the operation is simple.

3. Citrate system
Applicable coating: copper-zinc-tin ternary alloy imitation gold.

Advantages: wastewater is easy to treat, suitable for precision parts.

2. Cyanide-free imitation gold electroplating process
Pretreatment

Degreasing (alkaline or ultrasonic) → pickling (10% sulfuric acid) → activation (5% hydrochloric acid).

Pre-plating base layer (improving bonding strength)

Cyanide-free alkaline copper: such as pyrophosphate copper plating, thickness 1~2μm.

Cyanide-free nickel plating: optional (for parts with high corrosion resistance requirements).

Cyanide-free gold plating

Example of plating solution formula (HEDP system):

Copper sulfate (CuSO₄·5H₂O): 10~15 g/L

Zinc sulfate (ZnSO₄·7H₂O): 5~8 g/L

HEDP: 80~120 g/L

Sodium carbonate: 20~30 g/L (adjust pH to 10~11)

Brightener: trace (commercial additives such as AT-3)

Process parameters:

Temperature: 25~35℃

Current density: 0.5~1.5 A/dm²

Time: 1~3 minutes (thin layer) to 5~10 minutes (thick layer).

Post-treatment

Passivation: immersion in benzotriazole (BTA) solution (anti-discoloration).

Sealing protection: spray transparent epoxy resin or UV paint.